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Semiconductor Packaging Materials

Armonk, New York, United States

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General Info:

Semiconductor Packaging Materials Corporation provides design, development and engineering assistance for manufacturing companies in the world with advanced material technology. It focuses on electronic component interconnect solutions with emphasis in the telecom, automotive, medical, defense, aerospace and semiconductor industries. Semiconductor Packaging Materials Corporation s facilities in Malaysia, Morocco and the United States have achieved ISO/TS 16949:2002 certification. Its clients include ST Microelectronics, Delphi Corporation, Visteon Corporation, Guidant Corporation, Medtronic, Motorola, Tyco Electronics, Interpoint Raytheon Company and Seagate Technology. Semiconductor Packaging Materials Corporation produces a variety of jumper chips, bond pads, connectors, and solder and braze preforms. Semiconductor Packaging Materials Corporation is a subsidiary of SEMX Corporation, which is owned by Coining, one of the largest manufacturers of solder and brazing preforms for the microelectronic packaging industries worldwide.

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